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Often circuit applications require support in areas where connectors
or other components are applied. Here are the recommended types of
guidelines for stiffeners.

FR4/G10 Stiffeners:

  • Come in a variety of thickness' from .010" (.25mm), .020" (.50mm), .031" (.78mm), .047" (1.19mm) and .062" (1.57mm).
  • Can be bonded to a flex circuit using a pressure sensitive adhesive or a thermal set adhesive.
  • Are normally used to give added rigidity under a connector area.
  • Used as a carrier panel for automated assembly processing.
  • Hole size in the stiffener should be .015" (.38mm) larger than the circuit thru-hole to allow for registration tolerances.
  • Polyimide or polyester stiffeners:

  • Come in a variety of thickness' from .001" (.02mm) up to .015" (.38mm).
  • Can be bonded to a flex circuit using a pressure sensitive adhesive or a thermal set adhesive.
  • Can be used to give added thickness under conductor fingers to meet ZIF connector requirements.
  • Can be used to give added strength in high wear areas.
  • Can be blanked at the same time as the circuit outline to meet tight tolerance requirements.
  • Location of stiffener:

  • Stiffener and coverlay termination points should overlap a minimum of .030" (.76mm) to avoid stress points. Eliminating stress points reduce the chance of traces breaking.
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