Tolerance of +/- .003" (.076mm)
Layers:
Up to 6 Conductor Layers
Shielding Layer - copper and silver
Pads on Plating Layer
Flexible PCB
Automation Offers Mixed Form Factor Assembly
All Flex Adds Value With Complex Assembly Combinations Including:
Surface mount components up to 0204
Precise vision system allows placement accuracy to .001"
Fine pitch capability to .5mm pitch
Leaded devices
Tactile domes
Staked terminals
Unlimited component configurations
RoHS Compliant assembly
Virtually all SMT components including discretes, SOICs, PLCCs, QPPs, & BGA's
Auto fiducial correction
Standard Flexible PCB Materials
Base Materials:
About polyimide film at Dupont
About Rogers Corp
| Polyimide | 1/2 mil to 5 mils (.012mm - .127mm) |
| Polyester | 1 mil to 15 mils (Available with 1 oz. and 2 oz. copper) |
Adhesiveless Materials | Various thicknesses |
| Flame Retardant | Laminates and Coverlay |
| PEN | (Speak with All Flex staff regarding technical information) |
| LCP | Variety of constructions |
| Duroid Material |
Non plated through hole applications |
Base Copper:
1/2 oz. - .0007" (.018mm) thick copper
1 oz. - .0014" (.036mm) thick copper
2 oz. - .0028" (.071mm) thick copper
Copper thickness to 0.010"
Solder Mask:
Polyimide coverlay: 1/2 mil to 5 mils (.012mm - .127mm)
Polyester coverlay: 1 mil to 3 mils (.025mm - .076mm)
Soldermask
Photoimageable Coverlay
Surface Finish:
Hot Air Solder Level (HAL)
Tin Plating - electroless and electrolytic (RoHS Compliant)
Hard and Soft Gold over Nickel (RoHS Compliant)
Nickel (RoHS Compliant)
Silver (RoHS Compliant)
Rigidizers/Stiffeners:
G10/FR4
Aluminum
Polyimide
Polyester