Multi-Layer Construction Circuits

Multi-Layer flexible circuits consist of 3-8 copper layers encapsulated with dielectric, normally connected with a plated through-hole (see diagram below). Multi-layer circuits can be fabricated with or without coverlayers.

When to use Multi-Layer Flex
  • Required when circuit density and layout cannot be routed on a single layer
  • Ground and power plane applications
  • Used for shielding applications
  • Dense surface mount assembly
  • Increased circuit density
  • Controlled impedance with shielding
Multi-Layer Flex Features
  • Up to 8 conductive layers
  • Use of resistive foils like Cupronickel and Constantan possible
  • There are unbonded regions to increase flexibility
  • EMI/RFI shielding

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Design Guide

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